New Delhi, June, 2025.

MediaTek, the world’s leading fabless semiconductor company powering nearly 2 billion connected devices each year, has launched the MediaTek Dimensity 8450, a premium 5G smartphone chip designed to deliver exceptional performance, efficiency, and connectivity at the MediaTek India Dimensity Summit. The summit also marked the one-year anniversary of MediaTek Connect, a community of tech enthusiasts and fans, which engaged in a gaming tournament using MediaTek Dimensity devices. The company also showcased the Dimensity 5G chipset portfolio spanning flagship, premium, and entry-level smartphones across brands.

“With the launch of the MediaTek Dimensity 8450, we are expanding our portfolio of leading mobile platforms, giving device makers and users an even wider selection of premium experiences to choose from. This chip empowers users to unleash creativity with agentic AI and imaging capabilities while taking mobile gaming even further", said Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business Unit. “With our All Big Core design, also featured in our flagship chips, we’re demonstrating that exceptional performance and efficiency can coexist, ensuring consumers no longer have to choose between the two.”

MediaTek Dimensity 8450 SoC is designed to stream, broadcast, record, edit and publish with unparalleled quality and speed – 30% faster than competing platforms. Key features include:

·         All Big Core CPU design with eight Arm Cortex-A725 cores and an Arm Mali-G720 MC7 GPU, delivering higher peak performance while reducing power consumption.

·         MediaTek Dimensity Agentic AI Engine (DAE) that leverages the growing generative AI ecosystem and supports the latest global mainstream LLMs, SLMs, and LMMs.

·         Powerful NPU 880 bringing flagship level AI for leading GenAI and AI camera experience.

·         Delivers immersive gaming experiences in the premium segment with best FPS and superior power efficiency, enabled by its powerful all Big Core CPU and GPU.

·         Multi-frame EIS engine for enhanced 4K60 HDR (HLG) video capture with unparallel stabilization.

·         Built-in MediaTek Imagiq 1080 ISP with in sensor zoom technology (QPD remozaic).

·         5G-A modem with up to 3CC-CA and up to 5.17Gbps performance.

·         WQHD+ up to 144Hz and dual screen support.

The India Summit featured live demos of MediaTek Dimensity 5G chipsets including reasoning enhanced selected Q&A chat with AI, AI Telephoto Camera, gaming experiences on PUBG90 (BGMI) and Genshin impact.

The event brought together leading OEM partners including OPPO, Vivo, Motorola, Tecno, Redmi, Infinix, Realme, Samsung, Lava among others for an exclusive showcase of the company’s latest innovations across its 5G smartphone portfolio. Some of the latest smartphones showcased at the event included the Moto Edge 60 Pro with MediaTek Dimensity 8350, the OPPO Find X8 Pro with MediaTek Dimensity 9400, the Vivo X200 Pro with MediaTek Dimensity 9400, the Realme GT 7 with MediaTek Dimensity 9400e and the Tecno Phantom V Fold 2 with MediaTek Dimensity 9000+, among others.

The MediaTek Dimensity 5G family is a pioneer in innovation with reliable, global 5G, professional imaging, incredible gaming, and advanced AI. Featuring the Dimensity 9000, 8000, 7000 and 6000 series, the MediaTek Dimensity 5G chips redefine possibilities for everything from entry‑level to flagship smartphones. Further, OPPO will be the first OEM to launch the Reno14 Pro powered by the MediaTek Dimensity 8450 5G chipset. In addition, OPPO will launch another Dimensity 8450 smartphone in its K-series soon.